光电耦合器封装用环氧塑封料的制备  

Preparation of Epoxy Molding Compound Used for Optoelectric Coupler Package

作　　者：段杨杨 谭伟 李兰侠 蒋小娟 刘红杰 成兴明 范丹丹 DUAN Yangyang;TAN Wei;LI Lanxia;JIANG Xiaojuan;LIU Hongjie;CHENG Xingming;FAN Dandan(Jiangsu HHCK Advanced Materials Co.,Ltd,Lianyungang 222000,China)

机构地区：[1]江苏华海诚科新材料股份有限公司,江苏连云港222000

出　　处：《电子工业专用设备》2018年第5期19-21,共3页Equipment for Electronic Products Manufacturing

摘　　要：主要对光电耦合器用环氧模塑料的配方进行了研究。设计环氧塑封料配方体系,采用钛白粉作为反光填料,经高速混合机混合、双螺杆挤出机挤出,对光电耦合器封装用环氧模塑料的工艺流程进行了实验,获得较佳的工艺条件;以邻甲酚醛环氧树脂为基体树脂,以硅微粉和钛白粉为无机填料,采用正交实验法对光电耦合器封装用环氧模塑料进行了优化,获得了较优配方。制备了适合光电耦合器用的环氧模塑料。The formulation and the processing of epoxy molding compound （EMC） for optoelectric coupler （OPTO-COUPLER） packaging were mainly researched. In our paper,we design formulation system for EMC. Using titanium white as reflective filler,through high-speed premixure,twin-screw extruder,the preparation technology of EMC for OPTO-COUPLER was investigated,and theoptimum processing parameters was obtained. Selecting ortho-cresol novolac epoxy resin as matrixresin,silica powder and titanium white as inorganic filler,for mulation of EMC was studied byorthogonal experiment,and the optimum processing was gained. EMC used for OPTO-COUPLER packing was successfully synthesized.

关 键 词：环氧模塑料 反光填料 光电耦合器 

分 类 号：TN304.05[电子电信—物理电子学]