基于LFBGA的电热耦合仿真  

Electrical-Thermal Co-Simulation for LFBGA

作　　者：王洪辉 高波 孙海燕[2] WANG Hong-hui;GAO Bo;SUN Hai-yan(Tongfu Microelectronics Co.Ltd.,Nantong 226006,China;Jiangsu Key Laboratory of ASIC Design,Nantong University,Nantong 226019,China)

机构地区：[1]通富微电子股份有限公司,江苏南通226006 [2]南通大学专用集成电路设计重点实验室,江苏南通226019

出　　处：《中国集成电路》2018年第10期41-46,共6页China lntegrated Circuit

基　　金：江苏省科技厅重点研发计划项目资助(No.BE2016007-2);江苏省高校自然科学研究重大项目资助(No.16KJA510006)

摘　　要：为了验证芯片上的非均匀焦耳热和温度的相互作用,将电-热耦合仿真应用于薄型细间距球栅阵列(LFBGA)封装。基于ANSYS Siwave,首先仿真得到不均匀焦耳热。接着,在ANSYS Icepak中模拟温度结果。通过使用Siwave和Icepak之间的数据接口,可以实现双向耦合。热阻用于评估散热能力。根据耦合仿真结果,不均匀的焦耳热和温度同时上升。To verify the interaction of non-uniform power joule heat and temperature on chip, the electrical-thermal co-simulation is applied for low-profile fine-pitch ball grid array （ LFBGA ）. Based on ANSYS Siwave, the power dissipation is simulated firstly. Similarly, temperature is simulated in ANSYS Icepak. By using the data interface be- tween Siwave and Icepak, the two-way coupling can be accomplished. Thermal resistance is used to estimate the heat dissipation capability. According to the results, the non-uniform joule heat and temperature are rising simultaneously.

关 键 词：薄型细间距球栅阵列(LFBGA) 热阻 电热协同仿真 

分 类 号：TN405[电子电信—微电子学与固体电子学]