密封不良导致内引线键合失效的研究分析  

Research on Bonding Failure of Aluminum Wire Led by Poor Sealing in Seal Device

作　　者：符佳佳 闫玉波 李智 许艳君 FU Jia-jia;YAN Yu-bo;LI Zhi;XU Yan-jun(Beijing Zhenxing Institute of Metrology ＆ Test,Beijing 100074,China)

机构地区：[1]北京振兴计量测试研究所,北京100074

出　　处：《测控技术》2018年第B11期480-483,共4页Measurement & Control Technology

摘　　要：介绍了密封器件气密性检测方法以及内引线铝腐蚀引起器件失效的相关模式及机理。同时，结合某密封器件失效，利用电子扫描显微镜、能谱分析、半导体特性测试仪以及氦质谱检漏仪等手段，研究密封器件因气密性不良导致内引线键合失效的案例。结果显示，器件因气密性不良导致器件腔体内水汽含量增加以及器件内引线在键合时引入微量氯离子，两者相结合，最终促使内引线铝丝被腐蚀，生成絮状物，造成开路。为确保器件质量，器件在生产过程中，要严格控制生产环境，严格按照工艺流程；在使用前，要严格执行筛选测试。In the context of a specific case, the failure mode and mechanism of the Aluminum bonding wire in the sealing device were studied by semiconductor testing system, helium mass spectrometer leak detector, scan- ning electron microscope（SEM） and energy dispersive spectrometer（EDS）. The results indicated that the corro- sion of the aluminum bonding wire in the sealing device was caused by the moisture and chloride ions, respec- tively due to poor sealing and the pollution in the bonding process. The aluminum bonding wire was corroded to form a flocculation, which made the bonding open and the device failure. In order to ensure the quality of the device, the production environment should be controlled and the process strictly followed. Before the device is used, the screening test also should be performed strictly.

关 键 词：密封器件 铝丝腐蚀 失效分析 

分 类 号：TN405.96[电子电信—微电子学与固体电子学]