耐高温聚合物电容器薄膜研究进展  

Research Progress of High Temperature Resistance Polymer Dielectrics for Film Capacitors

作　　者：佟辉 范涛[1,2] 徐菊 TONG Hui;FAN Tao;XU Ju(Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100190,China;University of Chinese Academy of Sciences,Beijing 100190,China)

机构地区：[1]中国科学院电工研究所,北京100190 [2]中国科学院大学,北京100190

出　　处：《绝缘材料》2018年第11期1-6,13,共7页Insulating Materials

基　　金：国家重点研发计划项目(2016YFB0100600)

摘　　要：聚合物电介质由于具有较低的介质损耗、较高的电气强度、可加工性和分子结构可设计性等特点而被广泛应用于介电绝缘领域。然而,新一代功率电子产品对电介质薄膜的耐温性和介电性能提出了更高的要求。本文针对耐高温聚合物电介质,从分子设计的角度对如何提高介电性能进行了综述,并展望了未来的发展方向。Polymer dielectrics are widely used in dielectric and insulating field because of their low dielectric loss, high breakdown strength, good processibility, and molecular structure designability. However, new generation of power electronic products propose higher requirements on the temperature resistance and dielectric property of dielectric films. In this paper, the dielectric properties of high temperature resistance polymer dielectrics increased by molecular designing were reviewed, and their development direction were proposed.

关 键 词：介电常数 介质损耗 电气强度 耐温性 

分 类 号：TM215.3[一般工业技术—材料科学与工程]