表面活化Al_2O_3陶瓷与5005铝合金真空钎焊  

Vacuum brazing of active metallized Al_2O_3 ceramic to 5005 aluminum alloy

作　　者：朱永权 张丽霞[1] 任伟[1] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《焊接学报》2018年第11期78-82,共5页Transactions of The China Welding Institution

基　　金：国家优秀青年科学基金资助项目(51522404)

摘　　要：采用Al-Si钎料对经过Ag-Cu-Ti粉末活性金属化处理的Al_2O_3陶瓷与5005铝合金进行了真空钎焊,研究了钎焊接头的典型界面组织,分析了钎焊温度对接头界面结构特征及力学性能的影响.结果表明,接头典型界面结构为5005铝合金/α-Al+θ-Al2Cu+ξ-Ag2Al/ξ-Ag2Al+θ-Al2Cu+Al3Ti/Ti3Cu3O/Al_2O_3陶瓷.钎焊过程中,Al-Si钎料与活性元素Ti及铝合金母材发生冶金反应,实现对两侧母材的连接.随着钎焊温度的升高,陶瓷侧Ti3Cu3O活化反应层的厚度逐渐变薄,溶解进钎缝中的Ag和Cu与Al反应加剧,生成ξ-Ag2Al+θ-Al2Cu金属间化合物的数量增多,铝合金的晶间渗入明显;随钎焊温度的升高,接头抗剪强度先增加后降低,当钎焊温度为610℃时,接头强度最高达到15 MPa.The Al_2O_3 ceramic were metallized with the Ag-Cu-Ti powder, and then used Al-Si filler to braze Al_2O_3 ceramic and 5005 aluminum alloy. The influence of brazing temperature on the interfacial structures and shear strength has been researched. It was shown that the typical interface structure of the joints was 5005 aluminum alloy/α-Al+θ-Al2 Cu+ξ-Ag2 Al/ξ-Ag2 Al+θ-Al2 Cu+Al3 Ti/Ti3 Cu3 O/Al_2O_3 ceramic. During the brazing, Al-Si-Mg filler reacted with Ti and 5005 aluminum alloy, which made the joints of Al_2O_3 ceramic and 5005 aluminum alloy. With the increased of brazing temperature, the thickness of the Ti3 Cu3 O reaction layer adjacented to the Al_2O_3 ceramic was thinned. Besides,more Ag reacted with Cu and Al, and the amount of ξ-Ag2 Al+θ-Al2 Cu increased. And the shear strength of the joints increased firstly and then decreased with the increase of brazing temperature. The maximum shear strength of joints was 15 MPa when vacuum brazing was performed at 610 °C for 5 min.

关 键 词：活性金属化 真空钎焊 AL2O3陶瓷 抗剪强度 

分 类 号：TG454[金属学及工艺—焊接]