电路板填平工艺的研究  

Study on fill-leveling technology of printed circuit board

作　　者：程秀莲[1] 高庆 郝永平[1] 霸书红[1] CHENG Xiu-lian;GAO Qing;HAO Yong-ping;BA Shu-hong(College of Equipment Engineering of Shenyang Ligong University,Shenyang,Liaoning 110159,China)

机构地区：[1]沈阳理工大学装备工程学院,辽宁沈阳110159

出　　处：《粘接》2018年第12期40-44,共5页Adhesion

摘　　要：根据溅射铝桥对基片电路板粗糙度等性能的要求,筛选出了性能较好的E-39D(环氧树脂)作为填平胶的成膜物质,其中,固化剂为异佛尔酮二胺、稀释剂为502稀释剂。研究了打磨工艺、固化工艺和E-39D与稀释剂质量比对溅射在基片电路板上铝桥电阻的影响。结果表明,当采用填胶前后都用1.25μm(约7 000目)砂纸进行打磨、阶梯升温和固化前室温脱气等固化工艺以及E-39D与稀释剂质量比为100∶24时,铝桥电阻相对最小,能够满足火工品对换能元电阻值的要求。The E-39D epoxy resin as a better film forming substance, isophorone diamine as a better curing agent and 502 diluting agent as a better diluting agent for the fill-leveling glue were selected based on the roughness requirement of sputtering aluminum bridge presented by the substrate of printed circuit board. The effects of grinding process, curing process and mass ratio of epoxy resin and diluting agent on the resistance value of sputtering aluminum bridge of the printed circuit board were investigated. The results showed that when polishing the printed circuit board with 1.25 μm （about mesh number 7 000#） sandpaper before and after fill-leveling, deaerating the fill-leveling glue on the printed circuit board in room temperature, using the stepped heating curing process, and 100∶24 of mass ratio of epoxy resin and diluting agent, the aluminum bridge resistance value was minimum, the requirement of resistance value of energy conversion unit presented by the initiating explosive device was satisfied.

关 键 词：电路板 电阻 环氧树脂 稀释剂 铝桥 

分 类 号：TQ437[化学工程]