电镀废水中微量铜的快速测定  

Rapid determination of micro copper in electroplating effluent

作　　者：丘山 丘星初[1] 沙志勇[1] 刘经才 

机构地区：[1]福龙五金电业有限公司,广东番禺511483 [2]广州市番禺区环境监测站,广东番禺511400

出　　处：《电镀与涂饰》2002年第4期33-35,共3页Electroplating & Finishing

摘　　要：利用铜腙光度法测定电镀废水中的微量铜。优选出最佳测量波长 ,研究了酸度、柠檬酸浓度、显色剂浓度、温度及干扰元素对测量的影响。铜含量在 0～ 2 5 μg/ 2 5mL范围内遵守比尔定律。该方法简便、快捷 ,具有良好的选择性。Microcopper in electroplating effluent was determined by spectrophotometry with copper hydrazone as chromogenic agent. Optimum measuring wave length was selected. The effect of acidity, concentration of citric acid and chromogenic agent, temperature and interfering elements on the measurement was studied. The relation between absorbance and copper content follows Beer's Law provided that copper content is 0～25 μg/25 mL. This method is simple, rapid, and has good selectivity.

关 键 词：电镀废水 微量铜 快速测定 光度法 

分 类 号：X832[环境科学与工程—环境工程] X830.2