铜基上化学镀锡工艺研究  

An Investigation of Electroless Tin Plating on Copper Substrate

作　　者：陈春成[1] 

机构地区：[1]上海航天局802研究所,上海200333

出　　处：《电镀与精饰》2002年第5期20-22,共3页Plating & Finishing

摘　　要：研究了一种新型甲烷基磺酸化学镀锡工艺。介绍了镀液中各成分的作用 ,探讨了稳定剂、络合剂、还原剂、促进剂、防氧化剂、表面活性剂、温度、沉积时间等因素对沉积速度影响。结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。A new methane salfonic acid electroless tin plating technology aras investigated. Functions of bath constituents were introduced. The effect of stabilizing agent, complexing agent, reducing agent, promoter, surfactant, temperature, deposition time on deposition rate was studied. The results show that the process has high bath stability. It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.

关 键 词：铜基 化学镀锡 工艺 研究 甲烷基磺酸 

分 类 号：TQ153.13[化学工程—电化学工业]