陶瓷磨削温度对表面残余应力的影响  

The Effect of the Grinding Temperature on Ceramic Surface Residual Stresses

作　　者：田欣利[1] 于爱兵[2] 林彬[2] 

机构地区：[1]中国人民解放军装甲兵工程学院材料系 [2]天津大学机械工程学院

出　　处：《中国机械工程》2002年第18期1600-1601,共2页China Mechanical Engineering

基　　金：教育部重点实验室资助项目 ( YD-13)

摘　　要：研究了磨削热对陶瓷表面残余应力的影响。采用夹式热电偶结构和高精度信号调理器测试陶瓷磨削温度 ,根据正交设计法测量的磨削温度实验结果说明 :磨削温度随着磨削深度和砂轮速度的增加而提高 ;磨削深度 ap=3 0μm是磨削残余应力和磨削温度曲线的转变点 ;磨削温度随着连续磨削次数的增加而增加 。This paper presents the effect of grinding heat on grinding residual stress. Measuring grinding temperature with both clip-model thermocouple and signal adjustment device possesses ideal measuring precision. The test results of grinding temperature using orthogonal experimental design method show grinding temperature is raised with increasing of both grinding depth and wheel speed. The grinding depth a p =30μm is as the changing-point of grinding residual stress and grinding heat. On the other hand, grinding temperature is promoted gradually with increasing of continuous grinding number. Grinding temperature exists remarkable accumulating effect in the grinding process.

关 键 词：陶瓷磨削 残余应力 磨削温度 磨削参数 

分 类 号：TQ174.62[化学工程—陶瓷工业]