低温化学镀镍液中次磷酸钠还原效率的研究  

A Study of the Reduction Efficiency of Sodium Hypophosphite in Low Temperature Electroless Nickel Bath

作　　者：李建三[1] 

机构地区：[1]华南理工大学,广州510640

出　　处：《电镀与环保》2002年第5期17-19,共3页Electroplating & Pollution Control

摘　　要：对化学镀镍的反应机理进行分析 ,提出次磷酸钠还原效率的概念 ,推导出次磷酸钠还原效率的计算公式。通过实验测定低温化学镀镍工艺中次磷酸钠的还原效率 ,并讨论了次磷酸钠。The reaction mechanism of electroless nickel plating is analyzed; a concept of the reduction efficiency of sodium hypophosphite proposed; and the calculation formula for the efficiency derived. The reduction efficiency of sodium hypophosphite in low temperature electroless nickel plating process is determined through experiments; and the effects of sodium hypophosphite, complexing agents and accelerant on the reduction efficiency of sodium hypophosphite discussed.

关 键 词：低温 化学镀镍 次磷酸钠 还原效率 电镀 镀液 

分 类 号：TQ153.12[化学工程—电化学工业]