基于Icepak的密闭机箱热设计研究  

Thermal Analysis of an Airtight Cabinet Based on Icepak

作　　者：任恒[1] 刘万钧[1] 黄靖[1] 洪大良[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子科学技术》2015年第6期639-644,共6页Electronic Science & Technology

摘　　要：功率器件的散热对电子设备的性能和可靠性有重要的影响。本文对某密闭机箱的结构布局进行了优化,设计了有利于功率器件散热的结构形式,并采用热仿真软件Icepak对其进行了热仿真。结果表明,采用强迫风冷散热方式,能够将主要功率器件的壳温降至85℃以下,可以满足其可靠工作的温度要求。Power device cooling has an important effect on the performance and dependability of the whole electronic equipment. In this paper, the structure layout of an airtight cabinet is optimized, and a structural style beneficial to the power device cooling is designed. Then the thermal simulation of the overall cabinet is carried out by means of the CFD software Icepak. The simulation results show that the cooling method of forced convection can control the final temperature of the main power device below 85 degree, which is acceptable in view of stable working.

关 键 词：机箱 热设计 数值模拟 Icepak 

分 类 号：TN02[电子电信—物理电子学] TN958.92