材料破坏过程中应力分布的数值光弹图  

NUMERICAL PHOTOELASTIC FRINGE OF STRESS DISTRIBUTION DURING FAILURE PROCESS OF MATERIAL

作　　者：唐春安[1] 朱万成[1] 李连崇[1] 刘红元[1] 

机构地区：[1]东北大学材料破坏力学数值实验室,沈阳110004

出　　处：《力学与实践》2002年第5期47-50,共4页Mechanics in Engineering

摘　　要：介绍应用材料破坏过程分析（MFPA）系统进行材料破坏过程应力场分析的“数值光弹”方法 。给出了几种材料试样在外部载荷作用下变形或破坏时的内部应力分布条纹图.结果表明（MFPA）系统为研究材料破坏过程中的应力分布提供了一种简单易行的分析方法。The photoelasticity has a stringent re-quirement on the choice of material in the complex machining process. And it is difficult to measure the stress distribution during the failure process of a complex material subject to different loadings. In this paper, a 'numerical photoelastic method' that is achieved numerically with Material Failure Process Analysis (MFPA2D), is introduced, and the stress fringes during the deformation and failure of some specimens subjected to external loading are presented. Numerical results show that MFPA2D provides a simple way to study the stress distribu-tion during the failure process of material.

关 键 词：材料破坏 应力分布 光弹图 数值模拟 

分 类 号：TB303[一般工业技术—材料科学与工程] O348[理学—固体力学]