Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications  

作　　者：Ikuo OHNUMA Ryosuke KAINUMA Kiyohito ISHIDA 

机构地区：[1]Department of Materials Science,Graduate School of Engineering,Tohoku University,Sendai 980-8579,Japan

出　　处：《Progress in Natural Science:Materials International》2011年第2期97-110,共14页自然科学进展·国际材料（英文版）

基　　金：Project(51031003) supported by the National Natural Science Foundation of China;Projects(2009DFA52170,2009AA03Z101) supported by the Ministry of Science and Technology of China;Project(200910024) supported by Fujian Provincial Department of Science and Technology:Proiect(3502Z20093001) supported by Xiamen City Department of Science and Technology

摘　　要：Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys,which were constructed within the framework of the Thermo-Calc and DICTRA software,was presented.Especially,a thermodynamic tool, ADAMIS(alloy database for micro-solders) was developed by combining the thermodynamic databases of micro-solders with Pandat,a multi-component phase diagram calculation software program.ADAMIS contains 11 elements,namely,Ag,Al,Au,Bi,Cu, In,Ni,Sb,Sn,Zn and Pb,and can handle all combinations of these elements in the whole composition range.The obtained thermodynamic and kinetic databases can not only provide much valuable thermodynamic information such as phase equilibria and phase fraction,but also shows the kinetics and the evolution of microstructures when they are combined with some appropriate software programs and models,such as the phase field method and ADSTEFAN software.From the viewpoints of computational thermodynamics and kinetics,some technical examples were given to demonstrate the great utility of these databases for the applications in the development of micro-soldering materials.These databases are expected to be powerful tools for the development of micro-solders and Cu substrate materials,as well as for promoting the understanding of interfacial phenomena and microstructure evolution between solders and substrates in electronic packaging technology.Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys, which were constructed within the framework of the Thermo-Calc and DICTRA software, was presented. Especially, a thermodynamic tool, ADAMIS (alloy database for micro-solders) was developed by combining the thermodynamic databases of micro-solders with Pandat, a multi-component phase diagram calculation software program. ADAMIS contains 11 elements, namely, Ag, Al, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb, and can handle all combinations of these elements in the whole composition range. The obtained thermodynamic and kinetic databases can not only provide much valuable thermodynamic information such as phase equilibria and phase fraction, but also shows the kinetics and the evolution of microstructures when they are combined with some appropriate software programs and models, such as the phase field method and ADSTEFAN software. From the viewpoints of computational thermodynamics and kinetics, some technical examples were given to demonstrate the great utility of these databases for the applications in the development of micro-soldering materials. These databases are expected to be powerful tools for the development of micro-solders and Cu substrate materials, as well as for promoting the understanding of interfacial phenomena and microstructure evolution between solders and substrates in electronic packaging technology.

关 键 词：micro-soldering alloys THERMODYNAMICS KINETICS 

分 类 号：TP311.13[自动化与计算机技术—计算机软件与理论]