Review of metal matrix composites with high thermal conductivity for thermal management applications  被引量:25

Review of metal matrix composites with high thermal conductivity for thermal management applications

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作  者:Xuan-hui QU Lin ZHANG Mao WU Shu-bin REN 

机构地区:[1]State Key Laboratory for Advanced Metals and Materials, Beijing Key Laboratory for Powder Metallurgy and Particulate Materials, University of Science and Technology Beijing, Beijing 100083, China

出  处:《Progress in Natural Science:Materials International》2011年第3期189-197,共9页自然科学进展·国际材料(英文版)

基  金:Projects(2006AA03Z557,2008AA03A237) supported by the National High-tech Research and Development Program of China;Projects (2006CB605207,2011CB606306) supported by the National Basic Research Program of China;Projects(50274014,50634010, 50774005,51004010) supported by the National Natural Science Foundation of China

摘  要:Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal expansion are found widespread applications in electronic package and thermal management.The latest advances in manufacturing process,thermal properties and brazing technology of SiC/metal,carbon/metal and diamond/metal composites were presented.Key factors controlling the thermo-physical properties were discussed in detail.The problems involved in the fabrication and the brazing of these composites were elucidated and the main focus was put on the discussion of the methods to overcome these difficulties.This review shows that the combination of pressureless infiltration and powder injection molding offers the benefits to produce near-net shape composites. Improving wettability and optimizing interfacial structure are prerequisites for successful fabrication and further enhancement of thermal properties.A new Ag-Cu-Sn brazing alloy with low melting point is found to be effective to braze Al-matrix composites.Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal expansion are found widespread applications in electronic package and thermal management.The latest advances in manufacturing process,thermal properties and brazing technology of SiC/metal,carbon/metal and diamond/metal composites were presented.Key factors controlling the thermo-physical properties were discussed in detail.The problems involved in the fabrication and the brazing of these composites were elucidated and the main focus was put on the discussion of the methods to overcome these difficulties.This review shows that the combination of pressureless infiltration and powder injection molding offers the benefits to produce near-net shape composites. Improving wettability and optimizing interfacial structure are prerequisites for successful fabrication and further enhancement of thermal properties.A new Ag-Cu-Sn brazing alloy with low melting point is found to be effective to braze Al-matrix composites.

关 键 词:metal matrix composites electronic PACKAGING THERMAL CONDUCTIVITY COEFFICIENT of THERMAL EXPANSION BRAZING 

分 类 号:TB34[一般工业技术—材料科学与工程]

 

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