镀液配方及化学镀工艺对Ni-P合金镀层性能影响  

Influence of the Component of Plating Solution and the Chemical Plating Technology on the Performance of Ni-P Alloy Plating

作　　者：储凯[1] 王艳[1] 

机构地区：[1]四川工业学院,四川成都610039

出　　处：《表面技术》2002年第5期37-39,共3页Surface Technology

摘　　要：通过Ni P合金镀层硬度、耐蚀性与表面含磷量的关系 ,分析了镀液镍次比、pH值、络合剂、缓冲剂以及施镀温度、施镀时间、时效温度对Ni P合金化学镀层含磷量的影响 ,探讨了提高镀层表面硬度、耐磨性、耐蚀性的方法。Through studing the relationship of corrosion resistance,the hardness of Ni P alloy plating and the amount of P coatined in the surface,in this article the influence of these factors,for example,the ratio of Ni to hypophosphorous acid in plating solution,pH value,compound,buffer,as well as the temperature and the time of ageing on the mount of P contained in the Ni P alloy chemical plating is analyzed;and the method of improving the surface,wear resistance,corrosion resistance of the plating is inquired into. [

关 键 词：镀液 配方 化学镀 工艺 NI-P合金 镀层 性能 影响 

分 类 号：TQ153.2[化学工程—电化学工业]