镀金层微孔率检测方法的研究  

Investigation on the Methods for Measuring Porosity on Gold Plating

作　　者：周怡琳[1] 章继高[1] 

机构地区：[1]北京邮电大学电接触科研室,北京100876

出　　处：《电子元件与材料》2002年第11期19-21,共3页Electronic Components And Materials

摘　　要：为防止连接器在空气中污染腐蚀而导致电接触失效,广泛采用表面镀金工艺。但镀金层较薄,不可避免地出现微孔,形成微孔腐蚀。微孔率是评价连接器镀金质量的重要参数之一。采用潮湿SO2气体加速腐蚀,并配以显微镜分析是一种方便、快速的连接器镀金微孔率检测方法。采用这种方法检测同轴连接器镀金层,发现镀金层厚度不足1 mm时,微孔率大于600个/cm2,随镀金层厚度增加至3 mm以上,微孔率急剧减少,低于60 个/cm2。Gold plating is used widely on the connector surfaces to prevent corrosion, which may cause failure. However, the formation of pores is unavoidable in gold plating, for the gold plating is not thick enough. Corrosion may grow through these pores. Porosity is one of the important factors to evaluate the quality of gold plating on connectors. A quick and convenient method for measuring the porosity of gold plating on connectors is to accelerate corrosion with wet SO2 gas and to analyze with a microscope. Some coaxial connectors have been tested with the method and their porosity been found over 600/cm2 when the gold plating less than 1 mm. When the thickness reaches to over 3 mm, the porosity bargains to reduce rapidly until below 60 /cm2.

关 键 词：镀金层 微孔率 检测方法 加速腐蚀 连接器 数字通信系统 

分 类 号：TN914.3[电子电信—通信与信息系统] TQ153.18[电子电信—信息与通信工程]