添加剂对阴极电铜表面质量的影响  

The Influence of Additives on Surface Quality of Cathode Copper

作　　者：蒙延双[1] 李坚[1] 朱祖泽[1] 王达健[1] 

机构地区：[1]昆明理工大学材料与冶金工程学院,云南昆明650093

出　　处：《云南冶金》2002年第5期29-32,共4页Yunnan Metallurgy

摘　　要：研究明胶、硫脲、十二烷基磺酸钠、丙烯基硫脲及阿维同-A等作为添加剂 ,对阴极铜表面质量的影响。通过目测和金相显微观察对其影响效果进行了评价。结果表明 :十二烷基磺酸钠和阿维同-A的作用效果相似 ,丙烯基硫脲也能明显改善电铜表面质量 ,有望成为铜电解工艺中的添加剂。The influence of some additives on the quality of cathode copper has been investigated.The gelatine ,thiourea,avitone-A,sodium lanrul-sulfonate and allythiourea were used as additives in investigation.The influencial effects are assessed with visual checking and metallographic microscope.The results showed that the additive sodium lanrul-sulphona and avitone-A have the similar effect on improving quality of cathode copper,and allythiourea can also improve the surface quality of cathode copper.

关 键 词：添加剂 阴极电铜 表面质量 炼铜 电解 

分 类 号：TF811[冶金工程—有色金属冶金]