Ni-Ti活性钎焊高纯Al_2O_3界面反应微观机理  

Interface Reaction Mechanism of Joining Alumina to Kovarwith Ni-Ti Active Filler

作　　者：张春光[1] 乔冠军[1] 金志浩[1] 

机构地区：[1]西安交通大学,陕西西安710049

出　　处：《稀有金属材料与工程》2002年第5期371-374,共4页Rare Metal Materials and Engineering

摘　　要：基于部分液相瞬间连接工艺,采用Ni-Ti活性钎焊技术实现了高纯Al2O3陶瓷与可伐合金(4J33-Kovar)的气密性封接。采用微观组织分析、微区成分分析和X射线衍射分析等方法,研究了封接反应的微观机理。研究结果表明,氧化铝陶瓷中的氧扩散进入焊料中,在焊料/Al2O3界面形成了Ni2Ti4O反应层,厚度1μm～2μm,起到了陶瓷晶格到金属晶格的过渡作用。An airtight seal between pure alumina and Kovar was made using a Ni-Ti active filler by the 'Partial Transient Liquid Phase' (PTLP) bonding technique. The microstructure of the Al2O3/Ni-Ti/Kovar joint and the composition of the Al2O3/Ni-Ti interface was investigated by SEM and XRD respectively. The results showed that a I mum similar to 2 mum Ni2Ti4O reaction layer was formed at solder/alumina interface, and that this enabled the transition from the ceramic crystal lattice to the metal crystal lattice, because of its both metallic and ceramic properties.

关 键 词：活性钎焊 反应机理 氧化铝陶瓷 可代合金 

分 类 号：TG454[金属学及工艺—焊接]