LED封装用导电银胶的制备及性能研究  

Study on the Preparation and Properties of Conductive Adhesive for LED Packaging

作　　者：琚伟[1] 伊希斌[1] 张晶[1] 王启春[1] 陈义祥[2] 范会利[1] 牟秋红[1] JU Wei;YI Xibin;ZHANG Jing;WANG Qichun;CHEN Yixiang;FAN Huili;MU Qiuhong(New Material Institute, Shandong Academy of Sciences,Key Lab for Adhesion & Sealing Materials of Shandong Province, Ji’nan 250014, China;Technical Institute of Physics and Chemistry, Chinese Academy of Science, Beijing 100190, China)

机构地区：[1]山东省科学院新材料研究所山东省粘结材料重点实验室,济南250014 [2]中国科学院理化技术研究所,北京100190

出　　处：《贵金属》2016年第3期24-28,共5页Precious Metals

基　　金：山东省中青年科学家科研奖励基金(BS2011CL036);山东省自然科学基金(ZR2015YL002);中国科学院院地合作项目

摘　　要：通过研究树脂体系、固化剂及片状银粉对导电银胶体系力学性能、导电性能及耐候性能的影响,制备出可常温储存的导电银胶。结果表明,银粉质量含量75%,环氧树脂(EP)与聚酰胺酰亚胺树脂(PAI)质量比为80/20,二氨基二苯甲烷/二氨基二苯醚质量比为60/40,所配制的导电银胶的性能能够达到技术指标。样品经封装企业进行上线测试,能够满足应用要求。By the studing of the influential factors of the resin system, curing agent and flake silver powder on the mechanical properties, conductivity and weather resistance properties, a conductive adhesive which could be stored at room temperature was prepared finally. The results showed that the conductive adhesive with 75% silver powder, the quality ratio of EP resin to PAI resin being 80/20, the quality ratio of 4, 4-diaminodiphenyl methane to 4,4-oxydianiline being 60/40, could meet the technical indicators. After being tested in a LED packaging factory, the bulk production could meet the application requirements of the enterprise.

关 键 词：金属材料 LED 导电银胶 片状银粉 体积电阻率 剪切强度 

分 类 号：TM241[一般工业技术—材料科学与工程] O648.25[电气工程—电工理论与新技术]