铝基覆铜板导热系数测试方法改进分析  

Improved analysis on test approach of aluminum based copper clad laminate thermal conductivity

作　　者：任成伟[1] 师剑军[1] 马卫东[1] 张勇[1] REN Chengwei;SHI Jianjun;MA Weidong;ZHANG Yong(The Missile Institute of Air Force Engineering University, Xi’an 710051, China)

机构地区：[1]空军工程大学防空反导学院,陕西西安710051

出　　处：《电子元件与材料》2017年第1期80-84,共5页Electronic Components And Materials

摘　　要：为方便准确地测量铝基覆铜板的导热系数,设计了一种改进的导热系数测试方法。该方法用样本试件作为参照,利用两试件随环境变化导热系数比值近似不变的原理,求出待测试件的导热系数。经过理论分析与仿真验证后,搭建了一种新的铝基覆铜板导热系数测试平台。实验结果显示,该平台有效减少了测量误差,简化了操作流程,节约了实验成本。To measure easily and accurately the heat conduction parameter of aluminum base copper clad laminate, an improved heat conduction parameter measurement approach was designed. This approach took a sample as a reference, the heat conduction parameter of a PCB was calculated based on the theory that the heat conduction parameter proportion between two PCBs were nearly same. A novel aluminum base copper clad laminate test platform was constructed through theory analysis and simulation validation. The experiment results reveal that this platform can reduce measurement error effectively, simplify the operation process, and save the cost of experiments.

关 键 词：铝基覆铜板 导热系数 测试方法 热阻 热板 散热 

分 类 号：TP332.2[自动化与计算机技术—计算机系统结构]