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作 者:樊勋[1] 张广成[1] 李建通[1] 张鸿鸣[1] Fan Xun;Zhang Guangcheng;Li Jiantong;Zhang Hongming(Department of Applied Chemistry,School of Science,Northwestern Polytechnical University,Xi’an 710129,China)
机构地区:[1]西北工业大学理学院应用化学系,西安710129
出 处:《工程塑料应用》2017年第4期53-58,共6页Engineering Plastics Application
基 金:西北工业大学研究生创新创业种子基金项目(Z2017200)
摘 要:研究了液体端羧基丁腈橡胶(CTBN)增韧高分子量环氧树脂(EP,牌号CYD–014U)的超临界二氧化碳(SC–CO_2)微孔发泡及其泡孔结构,通过差示扫描量热(DSC)、动态热力学分析(DMA)和扫描电子显微镜(SEM)分别研究了不同含量CTBN共混体系的热性能、动态模量、断面形貌和不同发泡条件下的泡孔结构。研究发现,当CTBN含量从0%增加到30%时,EP/CTBN体系的玻璃化转变温度持续下降,其DSC测试结果从98.44℃下降至81.89℃。SEM观察断面和气体传质发现,CTBN含量增加基体塑化,出现两相结构,体系气体吸附量增加,解吸附速率加快。CTBN含量为10%~15%时,经60℃/12 MPa/72 h气体饱和以及110℃发泡10~15 s,泡孔尺寸为1~2μm,泡孔密度为5.60×10^(10)~6.28×10^(10)个/cm^3;随着发泡时间增加,泡孔经历成核、生长、聚并三个阶段,泡孔尺寸增加,泡孔密度先增后降。The conditions and cell structures of microcellular foams using supercritical carbon dioxide(SC–CO2)technology based on high molecular weight epoxy resin(CYD–014U)modified with carboxyl-terminated butadiene-acrylonitrile copolymer(CTBN)were researched.Differential scanning calorimeter(DSC),dynamic thermal mechanical(DMA)and scanning electron microscope(SEM)were used to analyze the thermal property,dynamical modulus and morphologies of fracture surface and cells.Itis found that as the contents of CTBN increases the temperature of glass transition measured by DSC persistently decreases,from98.44℃to81.89℃.SEM fracture surface shows plastic deformation of epoxy resin matrix and rubber phase separation appearswhen CTBN concentration increases.The CO2absorbed concentration improves and desorption speed accelerates as rubber contentsincreases.The cell diameter and cell density are from1μm and5.60×1010cells/cm3to2μm and6.28×1010cells/cm3duringthe10%–15%CTBN concentration when the samples are placed in autoclave at60℃,12MPa,72h and foams10s to15s at110℃.For the epoxy resin toughed with15%CTBN,as foaming time is up,the bubble periods can be divided into cell nucleation,cell growth and cell collection,and it can be concluded that the cell diameter is increased and the cell density is fimproved and then reduced.
关 键 词:EP/CTBN共混体系 超临界CO2 橡胶分相 泡孔生长 泡孔形貌
分 类 号:TB324[一般工业技术—材料科学与工程]
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