新型导电粘合剂改性技术研究进展  

Research Progress on the Modified technology New Electrically Conductive Adhesives

作　　者：孟德文[1] 白翰林 Meng Dewen;Bai Hanlin(No.33 Research Institute of China Electronics Technology Group Corporation, Shanxi, 030032)

机构地区：[1]中国电子科技集团公司第三十三研究所,山西030032

出　　处：《当代化工研究》2017年第1期103-104,共2页Modern Chemical Research

摘　　要：随着电子技术的迅猛发展,微电子产品正逐步向微型化、环保化和集成化等方向发展,新型导电粘合剂正替代传统焊接封装方式而广泛应用。本文针对当前导电粘合剂现状,分析了导电粘合剂不足,阐述了近年来导电粘合剂改性技术研究进展。With the rapid development electronic technology,electronic products are increasingly tending to be miniaturization,environmental,protection and integration,the new electrically conductive adhesives is widely used instead of traditional welding package.Based on the current situation of conductive adhesives,this study analyzes the shortage of conductive adhesives,and expounds the research progress inrecent years.

关 键 词：导电粘合剂 体积电阻率 导电粒子 改性技术 

分 类 号：T[一般工业技术]