Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering  

超声辅助钎焊Al/Sn接头界面组织演变和力学性能（英文）

作　　者：Wei-bing GUO Tian-min LUAN Xue-song LENG Jing-shan HE Jiu-chun YAN 郭卫兵;栾天旻;冷雪松;何景山;闫久春(哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001)

机构地区：[1]State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

出　　处：《Transactions of Nonferrous Metals Society of China》2017年第4期962-970,共9页中国有色金属学报（英文版）

基　　金：Project(51435004)supported by the National Natural Science Foundation of China

摘　　要：Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.低温下钎焊铝合金能够避免母材受热发生软化。研究了使用纯Sn超声钎焊纯Al时,初晶α(Al)对Al/Sn界面显微组织和结合强度的影响。结果表明,在液态Sn中,α(Al)的{111}面的表面能和生长速度最小,因此,析出的初晶α(Al)的形态为{111}面包围的正八面体。超声能够起到提高形核率并细化初晶α(Al)颗粒的作用。在较长的超声和保温时间下,Al/Sn界面会析出大量八面体初晶α(Al)颗粒,使界面呈现出一种起伏不平的形貌,增加了界面实际结合面积和咬合作用。超声作用40s,保温10min时界面的结合强度达到63MPa。

关 键 词：aluminum alloy tin ultrasonic soldering interfacial microstructure mechanical properties 

分 类 号：TG454[金属学及工艺—焊接]