基于组合参数分析的LED散热结构优化研究  

Heat dissipation structure optimization of LED based on combined parameter analysis

作　　者：韩娜[1] 崔国民[1] 马尚策 刘国辉[1] 周剑卫 HAN Na;CUI Guomin;MA Shangce;LIU Guohui;ZHOU Jianwei(Institute of New Energy Science and Technology, University of Shanghai for Science and Technology, Shanghai 200093, China;Harbin Boiler Company Limited, Harbin 150060, China)

机构地区：[1]上海理工大学新能源科学与工程研究所,上海200093 [2]哈尔滨哈锅锅炉工程技术有限公司,黑龙江哈尔滨150060

出　　处：《电子元件与材料》2017年第5期49-54,共6页Electronic Components And Materials

基　　金：上海市科委部分地方院校能力建设计划资助(No.16060502600);国家自然科学基金资助(No.51176125);沪江基金研究基地专项资助(No.D14001)

摘　　要：为了提高LED的散热性能,利用数值计算软件Icepak对其散热过程仿真模拟。LED散热受众多结构参数影响,选定影响芯片结温的主要因素,并逐一进行模拟计算,确定目标函数随各变量的变化趋势。为了进一步合理设计散热主体结构,通过正交试验优化参数组合,分析肋片个数、肋片高度、散热器高度以及基板厚度等4个因素对芯片结温的综合影响,得到优化后的参数组合。将所得最优组合参数解模拟计算,与初始结构相比芯片结温降低了9.02℃,达到了优化目标。Thermal simulation of LED system was carried out by Icepak to improve heat transfer efficiency.Several structural factors,which mainly affect the chip junction temperature,were selected among them to be simulated separately.As a result,the variation trend of the objective function with each factor was gained.In order to obtain a reasonable result,the orthogonal test method was used to optimize factors of the design.The general influence of the4factors(fin number,fin height,heatsink height and substrate thickness)on the chip junction temperature was analyzed.Finally,an optimized result was obtained,and the LED junction temperature decreased by9.02℃,which show the effectiveness of the proposed method.

关 键 词：LED散热 数值模拟 组合参数 结构优化 正交试验 散热性能 

分 类 号：TN603[电子电信—电路与系统]