铝带键合点根部损伤研究  

Investigation about the Damnification of Bond Root Part in Ribbon Bonding Process

作　　者：潘明东 朱悦 杨阳 徐一飞 陈益新 Pan Ming-dong;Zhu Yue;Yang Yang;Xu Yi-fei;Chen Yi-xin(Chang Jiang Electronics Technology(SU QIAN)Co.,Ltd,Jiangsu Suqian 221200)

机构地区：[1]长电科技宿迁股份公司,江苏宿迁223800

出　　处：《电子质量》2017年第5期89-92,105,共5页Electronics Quality

摘　　要：铝带键合作为粗铝线键合的延伸和发展,键合焊点根部损伤影响了该工艺的发展和推广,该文简述了铝带键合工艺过程,分析了导致铝带键合点根部损伤的制程因素:不同型号铝带劈刀端面设计对键合点根部损伤的影响;铝带劈刀端面沾污积铝会导致键合点根部损伤加剧;导线管高度过高会导致第一焊点键合点根部机械损伤;引线框架管脚压合状态调试不当会直接导致铝带根部断裂;键合参数设置不当会对键合点根部过应力损伤。Ribbon bonding for the extension and development of Al wire,the damnification of bond root part has affected the development and promotion of the process,this paper has summarized the ribbon bonding process,analyzed the damage causes about ribbon bonding root of process factors:The different designs of ribbon tooling with cleaver face will impact on bond root;The deposition of Al on ribbon tooling with cleaver will raise the damnification of bond root part;If wire guide height is too high,it will lead to mechanical damage of the first bonding root;Improper debugging about clamping status of Lead frame will directly lead to crack on ribbon root part;Improper bonding parameter will injure bond root part.

关 键 词：铝带键合 根部损伤 劈刀 

分 类 号：TN405[电子电信—微电子学与固体电子学]