致冷晶片表面热喷涂处理工艺在半导体制冷器生产中的应用  

Application of Surface Thermal Spraying Process on Cooling Chips in Semiconductor Chiller Production

作　　者：魏洪菊 张永强 Wei Hongju;Zhang Yongqiang(Xuchang City High-tech Technology Innovation Service Center Co., Ltd.,Xuchang Henan 461000;Xuchang City Supply and Marketing Cooperative,Xuchang Henan 461000)

机构地区：[1]许昌市高新技术创业服务中心有限公司,河南许昌461000 [2]许昌市供销合作社,河南许昌461000

出　　处：《河南科技》2017年第7期90-91,共2页Henan Science and Technology

摘　　要：半导体致冷组件(器件)是电力电子产业的重要组成部分,行业要求专业性较强。半导体致冷(组件)器件的加工过程主要包括半导体切割、喷涂、组装、焊接4个关键环节。本文重点对加工过程中的喷涂环节,采用致冷晶片表面处理热喷涂工艺所产生的作用进行探讨。Semiconductor cooling components(devices)is an important part of the power electronics industry,the industry requires strong professional.The process of semiconductor refrigeration device includes four key steps:cutting,spraying,assembling and welding.This paper focused on the analysis of the spraying process in the process,and the effect of the surface thermal spraying process on cooling chips.

关 键 词：半导体致冷 致冷晶片 热喷涂 技术要点 应用优势 

分 类 号：TB657[一般工业技术—制冷工程]