金银饰品电镀中抛光工艺参数数学优化方法研究  

Study on Optimization Method of Polishing Process Parameters in Gold and Silver Jewelry Electroplating

作　　者：刘志红[1] 刘明明[1] Liu Zhihong;Liu Mingming(Zhengzhou Institute of Finance and Economics,College of Information Engineering,Zhengzhou 450044,China)

机构地区：[1]郑州财经学院信息工程学院,河南郑州450044

出　　处：《科技通报》2017年第7期205-208,共4页Bulletin of Science and Technology

摘　　要：传统方法在金银饰品镀后抛光处理过程中,由于抛光工艺参数选定不合理等原因,导致出现抛光后金银饰品表面的光亮度较差、饰品表面粗糙的问题。提出一种基于正交实验设计的金银饰品电镀中抛光工艺参数数学优化方法,依据镀后饰品的镀层厚度和表面粗糙度指标,检测各抛光工艺参数的重要度,依据分析正交实验结果来选定最佳抛光工艺参数及参数组合。实验证明提出的方法能够有效地优化镀后金银饰品的抛光工艺参数,提高饰品光亮度、降低粗糙度。Traditional methods in the process of gold and silver jewelry polishing treatment process,due tothe selection of polishing process parameters is not reasonable and other reasons,resulting in the surfaceof gold and silver jewelry is poor,the surface roughness of jewelry.Put forward a kind of based onorthogonal experimental design of gold and silver jewelry electroplating polishing process parametermathematical optimization method,according to the plating jewelry coating thickness and surfaceroughness index,the important degree of each polishing process parameters detection,based on theanalysis of the results of orthogonal experiments to selected optimal polishing process parameters and thenumber of parameter combinations.The experimental results show that the proposed method caneffectively optimize the polishing process parameters of gold and silver jewelry,improve the brightnessand reduce the roughness of the jewelry.

关 键 词：金银饰品 电镀 抛光参数 数学优化方法 

分 类 号：TH162[机械工程—机械制造及自动化]