微量Ti对Sn-9Zn-xTi无铅焊料耐蚀性的影响  

Effect of trace Ti on corrosion resistance of lead-free Sn-9Zn-xTi solder

作　　者：谢景洋 王正宏[1] 陈一鸣[1] 张弓[1] XIE Jingyang;WANG Zhenghong;CHEN Yiming;ZHANG Gong(Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China)

机构地区：[1]清华大学机械工程系,北京100084

出　　处：《电子元件与材料》2017年第8期103-110,共8页Electronic Components And Materials

摘　　要：Sn-Zn无铅焊料耐蚀性差是阻碍其应用推广的重要因素。本文通过在Sn-9Zn共晶合金中添加微量的Ti(质量分数=0,0.01%,0.03%,0.05%,0.1%),测量合金在质量分数3.5%Na Cl溶液中的极化曲线(I/E)和电化学阻抗谱(EIS),利用扫描电镜(SEM)对合金表面相貌进行了观察,并研究了不同浸泡时间下合金耐蚀性的变化。发现微量Ti能有效改善Sn-9Zn的耐蚀性,其中质量分数0.05%的Ti添加量最为合适。The poor corrosion resistance of Sn-Zn lead-free solder are important factors hindering its application.In this paper,by adding trace amounts of Ti to Sn-9Zn eutectic alloys(mass fractions=0,0.01%,0.03%,0.05%,0.1%),the potential dynamic polarization curves(I/E)and electrochemical impedance spectroscopy(EIS)of Sn-9Zn-xTi alloys in3.5%(mass fraction)NaCl solution were measured.The surface appearance of the alloy was observed by scanning electron microscopy(SEM).The corrosion resistance of the alloy under different immersion time was studied.It is found that trace Ti element can improve the corrosion resistance of Sn-9Zn,and0.05%Ti(mass fraction)content is the most suitable.

关 键 词：Sn-Zn无铅焊料 耐蚀性 微量Ti 动电位极化曲线 电化学阻抗谱 腐蚀形貌 

分 类 号：TN601[电子电信—电路与系统]