Cu-Al interfacial compounds and formation mechanism of copper cladding aluminum composites  

铜包铝复合材料界面金属间化合物及形成机理（英文）

作　　者：Di CHU Jian-yu ZHANG Jin-jin YAO Yan-qiu HAN Chun-jing WU 初娣;张建宇;姚金金;韩艳秋;吴春京(北京科技大学材料科学与工程学院,北京100083;河北工程大学机电工程学院,邯郸056038)

机构地区：[1]School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China [2]School of Mechanical and Electrical Engineering, Hebei University of Engineering, Handan 056038, China

出　　处：《Transactions of Nonferrous Metals Society of China》2017年第11期2521-2528,共8页中国有色金属学报（英文版）

基　　金：Project(51274038)supported by the National Natural Science Foundation of China

摘　　要：Copper cladding aluminum(CCA)rods with the section dimensions of12mm in diameter and2mm in sheath thickness were fabricated by vertical core-filling continuous casting(VCFC)technology.The kinds and morphology of interfacial intermetallic compounds(IMCs)were investigated by SEM,XRD and TEM.The results showed that the interfacial structure of Cu/Al was mainly composed of layeredγ1(Cu9Al4),cellularθ(CuAl2),andα(Al)+θ(CuAl2)phases.Moreover,residual acicularε2(Cu3Al2+x)phase was observed at the Cu/Al interface.By comparing the driving force of formation forε2(Cu3Al2+x)andγ1(Cu9Al4)phases,the conclusion was drawn that theε2(Cu3Al2+x)formed firstly at the Cu/Al interface.In addition,the interfacial formation mechanism of copper cladding aluminum composites was revealed completely.采用垂直充芯连铸工艺制备了直径为12 mm、铜层厚度为2 mm的铜包铝复合材料。通过SEM、XRD和TEM对界面金属间化合物的种类和形态进行了研究。研究结果表明,Cu_/Al界面主要由层状γ_1(Cu_9Al_4)相、胞状θ(Cu_Al_2)相和α(Al)+θ(Cu_Al_2)共晶组成,特别是在界面组织中观察到残留的针状Cu_3Al_(2+x)相。通过比较γ_1(Cu_9Al_4)和ε_2(Cu_3Al_(2+x))的形核驱动力,证明了ε_2(Cu_3Al_(2+x))相优先在界面处形成。此外,完整揭示了铜包铝复合材料界面形成机理。

关 键 词：copper cladding aluminum composite vertical core-filling continuous casting interfacial formation mechanism 

分 类 号：TB331[一般工业技术—材料科学与工程]