CVD Micro-diamond Coated Tool Lapping with Sapphire Wafer  

CVD Micro-diamond Coated Tool Lapping with Sapphire Wafer

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作  者:Feng Wei Lu Wenzhuang Yu Yaping Yang Bin Zuo Dunvuen 

机构地区:[1]College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,P.R.China [2]College of Mechanical Engineering,Yancheng Institute of Technology,Yancheng 224051,P.R.China

出  处:《Transactions of Nanjing University of Aeronautics and Astronautics》2017年第1期81-88,共8页南京航空航天大学学报(英文版)

基  金:supported by the National Nature Science Foundation of China(No.51275230);NUAA Research Funding(No.kfjj20150507);Six Talent Peak of Jiangsu(No.ZBZZ-002);the Funding of Jiangsu Innovation Program for Graduate Education(No.KYLX_0227);the Fundamental Research Funds for the Central Universities

摘  要:Micro-diamond films were prepared on YG6 substrate by hot filament chemical vapor deposition method.An innovative micro-diamond coated tool was used to the lap sapphire wafer.The effect of load,rotating speed,and lapping time on material removal rate(MRR)and surface roughness was investigated.The results showed that the best process parameters were 3N,100r/min and 15 min.The surface quality of sapphire improved significantly after lapping.The coating after lapping adhered well and did not show any peeling.The innovative micro-diamond coated tool was feasible and suitable for the lapping of the single crystal sapphire wafer.Micro-diamond films were prepared on YG6 substrate by hot filament chemical vapor deposition method.An innovative micro-diamond coated tool was used to the lap sapphire wafer.The effect of load,rotating speed,and lapping time on material removal rate(MRR)and surface roughness was investigated.The results showed that the best process parameters were 3N,100r/min and 15 min.The surface quality of sapphire improved significantly after lapping.The coating after lapping adhered well and did not show any peeling.The innovative micro-diamond coated tool was feasible and suitable for the lapping of the single crystal sapphire wafer.

关 键 词:micro-diamond film SAPPHIRE surface ROUGHNESS LAPPING 

分 类 号:TG71[金属学及工艺—刀具与模具] TG66

 

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