W-Cu薄膜沉积初期亚稳态固溶体形成机制  

Mechanism of Metastable Solid Solution Formation of W-Cu Thin Films at the Initial Stage of Deposition Process

作　　者：谢添乐 周灵平[1,2] 符立才 朱家俊[1] 杨武霖[1] 李德意 XIE Tianle;ZHOU Lingping;FU Licai;ZHU Jiajun;YANG Wulin;LI Deyi(College of Materials Science and Engineering, Hunan University, Changsha 410082;Key Laboratory of Spray Deposition Technology of Hunan Province, Changsha 410082)

机构地区：[1]湖南大学材料科学与工程学院,长沙410082 [2]湖南省喷射沉积技术重点实验室,长沙410082

出　　处：《材料导报》2016年第24期98-102,共5页Materials Reports

基　　金：国家自然科学基金(51401080)

摘　　要：采用直流双靶磁控溅射共沉积的方法制备了W含量为75%(原子分数)的W-Cu薄膜,并通过EDS、XRD、SEM、TEM等对W-Cu薄膜沉积初期的微观形貌及组织结构进行了表征和分析。结果表明,沉积初期,随着沉积时间延长,W-Cu薄膜有逐渐晶化的趋势,并形成了W(Cu)基亚稳态固溶体,且Cu在W中的固溶度逐渐增加。沉积10s时薄膜呈长程无序、短程有序的非晶态,局部有由于靶材粒子扩散不充分而形成的小于5nm的W、Cu纳米晶;20s时局部纳米晶消失但晶化程度升高;30s时晶化显著。沉积初期W-Cu薄膜随沉积时间延长逐渐晶化的原因是沉积过程中高能量的原子或原子团与已沉积的原子碰撞,传递能量,促进原子进一步扩散,克服了薄膜的晶化形成能,从而形成了亚稳态的W(Cu)固溶体。W-Cu alloy thin films with75%W were deposited by DC double targets magnetron co sputtering.The composition,microstructure and organization structure of thin films were analyzed by XRD,EDS,SEM and TEM.The results showed that the structure of the W-Cu thin films was metastable supersaturated solid solution.With the incremental of deposition time,the thin films had a tendency to crystallization and the Cu solubility increased.After deposition for10s,the microstructure of W Cu thin film was long range disorder but short range ordered amorphous state and have formed W,Cu nano crystalline with grain size of less than5nm in local area due to the insufficient particle diffusion of target.After20s,the local nano crystalline disappeared but crystallization degree increased,and after30s,the grain size increased obviously.At the initial stage of deposition process,the reason of the crystallization is that high energy of atoms or atomic group collision with the deposited atoms,and transferred energy which promote the atomic diffusion and overcome the energy of crystallization,thus formed the metastable W(Cu)solid solution.

关 键 词：W-Cu薄膜 沉积初期 微观结构 晶化 

分 类 号：TB303[一般工业技术—材料科学与工程]