缓冲剂对亚硫酸盐-硫代硫酸盐化学镀金液稳定性及镀层形貌的影响  

Effects of different buffer solutions on stability of sulfite–thiosulfate electroless gold plating bath and morphology of coating

作　　者：吕泽满 常任珂 王兵毅 谭桂珍[1] 郝志峰[1] 丁启恒 柯勇 LYU Ze-man;CHANG Ren-ke;WANG Bing-yi;TAN Gui-zhen;HAO Zhi-feng;DING Qi-heng;KE Yong(School of Chemical Engineering and Light Industry, Guangdong University of Technology,Guangzhou 52006, China)

机构地区：[1]广东工业大学轻化学院,广东广州510006 [2]深圳市荣伟业电子有限公司,广东深圳518116 [3]景旺电子科技(龙川)有限公司,广东河源517300

出　　处：《电镀与涂饰》2018年第4期155-159,共5页Electroplating & Finishing

基　　金：2016年广东省应用型科技研发专项资金项目(2016B090930004)

摘　　要：研究了CH_3COOH-CH_3COONa、C_6H_8O_7-Na_3C_6H_8O_7、C_6H_8O_7-Na_2HPO_4和Na_2HPO_4-NaH_2PO_4这4种缓冲体系对亚硫酸盐-硫代硫酸盐化学镀金液稳定性和镀层性能的影响。镀液的基本组成和工艺条件为:Na_3Au(SO_3)_2(以Au^+计)1 g/L,Na_2SO_3 12.6 g/L,Na_2S_2O_3·5H_2O 24.9 g/L,pH 6.5,温度65°C,时间5 min。4种缓冲体系都能在一定程度上提高镀液的高温稳定性及其对镍离子和化学镀镍还原剂(次磷酸钠)的耐受度。采用C_6H_8O_7-Na_2HPO_4缓冲体系时,镀金层厚度最均匀,表面最光滑、致密。The effects of four buffer solutions including CH3COOH–CH3COONa,C6H8O7–Na3C6H8O7,C6H8O7–Na2HPO4,and Na2HPO4–NaH2PO4on the stability of sulfite–thiosulfate electroless gold plating bath and the properties of gold coating obtained therefrom were studied.The basic bath composition and process conditions are as follows:Au+(added as Na3Au(SO3)2)1g/L,Na2SO312.6g/L,Na2S2O35H2O24.9g/L,pH6.5,temperature65°C,and time5min.The four buffer solutions are able to improve the stability of the electroless gold plating bath at high temperature and its tolerance to nickel ions and sodium hypophosphite(a reducing agent for electroless nickel plating).The gold coatings obtained from the bath with C6H8O7–Na2HPO4buffer solution exhibit the most uniform thickness,smoothest surface,and best compactness.

关 键 词：化学镀金 缓冲剂 亚硫酸盐 硫代硫酸盐 稳定性 形貌 

分 类 号：TQ153.18[化学工程—电化学工业]