印刷电路板铜电路表面化学镀镍前预镀镍替代无钯活化  

Electroless nickel pre-plating as a substitute for palladium activation before electroless nickel plating on copper patterns of printed circuit boards

作　　者：姚俊合 何湘柱[1] 陈云毅 唐旭东 彭胜隆 YAO Jun-he;HE Xiang-zhu;CHEN Yun-yi;TANG Xu-dong;PENG Sheng-long(School of Chemical Engineering and Light Industry, Guangdong University of Technology,Guangzhou 52006, China)

机构地区：[1]广东工业大学轻化学院,广东广州510006

出　　处：《电镀与涂饰》2018年第4期160-164,共5页Electroplating & Finishing

摘　　要：在印刷电路板的铜电路表面化学预镀镍后再进行化学镀镍,研究了预镀镍溶液中还原剂质量浓度、配位剂质量浓度、pH和温度对预镀镍开始所需时间和预镀镍层厚度的影响,获得较优的预镀镍配方和工艺条件为:NiSO_4·7H_2O 40 g/L,H_3BO_3 30 g/L,NH_4Cl 30 g/L,柠檬酸铵30 g/L,二甲胺基硼烷(DMAB)3 g/L,pH 9.0,温度60°C,时间3 min。在最佳条件下预镀镍后进行化学镀镍所得镀层的结合力合格,外观与钯活化后化学镀镍所得镀层相差不大,但其晶粒更细致,耐蚀性更优。The electroless nickel plating on copper patterns of printed circuit board was conducted after electroless nickel pre-plating.The effects of mass concentrations of reductant and complexant,pH and temperature on the incubation time for electroless nickel pre-plating and the thickness of electrolessly pre-plated nickel coating were studied.The optimal bath composition and operation conditions for electroless nickel pre-plating were obtained as follows:NiSO4·7H2O40g/L,H3BO330g/L,NH4Cl30g/L,triammonium citrate30g/L,dimethylaminoborane(DMAB)3g/L,temperature60°C,pH9.0,and time3min.The electrolessly plated nickel coating obtained after pre-plating under the optimal conditions features a qualified adhesion to the substrate and an appearance similar to that obtained after traditional palladium activation,but the former has a more compact structure and better corrosion resistance as compared with the later.

关 键 词：印刷电路板 化学镀镍 预镀 钯活化 耐蚀性 结合力 

分 类 号：TQ153.2[化学工程—电化学工业]