超细片状银粉的制备技术研究进展  

Research Progress on Preparation Technologies of Ultra Fine Flake Silver Powder

作　　者：冯清福 孟宪伟[1] 梁云[1] 李世鸿[1] FENG Qingfu;MENG Xianwei;LIANG Yun;LI Shihong(State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China)

机构地区：[1]昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,昆明650106

出　　处：《贵金属》2018年第1期86-93,共8页Precious Metals

摘　　要：超细片状银粉比传统大尺寸银粉可更好地满足电子产品发展需求。对机械球磨法和化学还原法2种制备超细片状银粉方法进行了对比分析。球磨法产率高、成本低,但易引入杂质且技术指标难保持一致;化学法制备的银粉形貌粒径均一性高,但产率低。介绍了化学还原法的技术特点,对其生长机理进行了分析。提出对球磨工艺的深入研究,以及化学法中保持高品质银粉情况下提高反应体系浓度,是超细片状银粉制备技术的研究重点。Ultra fine flake silver powder serves the development needs of electronic products better than the traditional large size of silver powder.The contrastive analysis was carried out for the mechanical milling and chemical reduction methods used for preparing ultra fine flake silver powder.Ball milling method has high yield and low cost,but it is easy to introduce impurities and the technical specifications are difficult to maintain.The silver particles prepared by chemical method has high homogeneity and low yield.The technical characteristics of chemical reduction method are introduced,and its growth mechanism is discussed.The further research on ball milling technology and the concentration of reaction system under high quality silver powder in chemical process are the key points for the preparation technology of ultrafine flake silver powder.

关 键 词：金属材料 片状银粉 超细 化学还原 球磨 生长机制 

分 类 号：TM241[一般工业技术—材料科学与工程]