激光诱导ABS塑料表面化学镀镍–磷–铜合金及其电磁遮蔽性能  

Electroless plating of nickel–phosphorus–copper alloy on the surface of ABS plastic activated by laser and its electromagnetic shielding property

作　　者：张德虎[1] 钟良[1] 崔开放 代竟雄 ZHANG De-hu;ZHONG Liang;CUI Kai-fang;DAI Jing-xiong(College of Science and Engineering, Southwest University of Science and Technology,Mianyang 621000, China)

机构地区：[1]西南科技大学制造科学与工程学院,四川绵阳621000

出　　处：《电镀与涂饰》2018年第5期205-208,共4页Electroplating & Finishing

基　　金：四川省大学生创新基金(17CXCY60)

摘　　要：先在ABS塑料表面涂覆10 g/L NiSO_4·6H_2O+40 g/L NaH_2PO_2·H_2O混合溶液进行预活化,再采用光斑直径为1 mm和波长为450 nm的激光(功率1 W)在5 mm/s的速率下进行活化,最后在以下条件下化学镀Ni–P–Cu合金:Ni SO_4·6H_2O 28 g/L,CuSO_4·5H_2O 0.04 g/L,NaH_2PO_2·H_2O 20 g/L,乳酸20 g/L,CH_3COONa·3H_2O 15 g/L,硫脲0.9 mg/L,pH 5,温度80°C,时间30 min。激光活化后的ABS塑料表面形成了一层具有催化作用的活性镍微粒。随后化学镀所得Ni–P–Cu合金镀层均匀、致密,与基体间结合良好,电磁屏蔽性能满足军工技术的要求。The ABS plastic coated with a mixture of10g/L NiSO4·6H2O and40g/L NaH2PO2·H2O is activated by laser with a power of1W,a beam diameter of1mm,and a wavelength of450nm at a scanning rate of5mm/s,and then subjected to electroless Ni-P-Cu alloy plating under the following conditions:NiSO4·6H2O28g/L,CuSO4·5H2O0.04g/L,NaH2PO2·H2O20g/L,lactic acid20g/L,CH3COONa·3H2O15g/L,thiourea0.9mg/L,pH5,temperature80°C,and time30min.A layer of activated nickel micro-particles with a function of catalysis was formed on ABS plastic after laser activation.The electrolessly plated Ni-P-Cu alloy coating obtained thereon is uniform and compact with a good adhesion to substrate and has an electromagnetic shielding performance meeting the military requirements.

关 键 词：丙烯腈.丁二烯.苯乙烯共聚物 激光诱导 镍–磷–铜合金 化学镀 电磁屏蔽 

分 类 号：TQ153.2[化学工程—电化学工业]