先进热管理材料研究进展  

Research Progress of Advanced Thermal Management Materials

作　　者：何鹏[1] 耿慧远[1,2] HE Peng;GENG Hui-yuan(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;Zhengzhou Research Institute of Mechanical Engineering,Zhengzhou 450001,China)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]郑州机械研究所,郑州450001

出　　处：《材料工程》2018年第4期1-11,共11页Journal of Materials Engineering

基　　金：国家国际科技合作专项资助(2015DFA50470)

摘　　要：热管理系统广泛应用于国民经济以及国防等各个领域,控制着系统中热的分散、存储与转换。先进的热管理材料构成了热管理系统的物质基础,而热传导率则是所有热管理材料的核心技术指标。本文针对先进热管理材料的应用、种类以及其中热传导的物理机制等关键问题进行了综述。重点介绍了热界面材料、高导热封装材料、蓄热材料以及热电材料等的研究进展及存在的问题。对均质及复合材料中的热传导机制进行归纳,并指出分子动力学、密度泛函理论及大规模并行计算技术将在揭示多尺度的热传输机制方面发挥越来越重要的作用。Thermal management systems,controlling the dispersion,storage and conversion of heat,were widely used in various fields of national economy and defence applications etc.Advanced thermal management materials form the material basis of the thermal management system,while the thermal conductivity was the critical property of all the thermal management materials.The application,classification,and physical mechanism of heat conduction of advanced thermal management materials were reviewed in this paper.The research progress and existing problems of thermal interface materials,high thermal conductivity packaging materials,thermal storage materials and thermoelectric materials were introduced.It is pointed out that molecular dynamics,density functional theory and large-scale parallel computing technology will play increasingly import roles in revealing the multi-scale heat transfer mechanism in the homogeneous and composite materials.

关 键 词：热管理 热界面材料 高导热封装材料 蓄热材料 热电材料 热导率 

分 类 号：TB303[一般工业技术—材料科学与工程]