二次注射成型工艺参数对PMMA-PC复合平板翘曲的影响  

Effect of Overmolding Injection Parameters on Warpage of PMMA-PC Composite Board

作　　者：孙琦伟 陈宇宏 颜悦 郎建林 王韬 葛勇 SUN Qi-wei;CHEN Yu-hong;YAN Yue;LANG Jian-lin;WANG Tao;GE Yong(Institute of Transparency,AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China)

机构地区：[1]中国航发北京航空材料研究院透明件研究所,北京100095

出　　处：《材料工程》2018年第4期134-139,共6页Journal of Materials Engineering

摘　　要：研究了基于聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)两种材料的二次注射成型中不同工艺参数,包括保压压力、保压时间、熔体温度、模具温度及注射速率等对PMMA-PC复合平板制件翘曲量的影响。结果表明:随保压压力的增大,翘曲量呈现先减小后增大趋势;保压时间的延长则有利于减少复合平板的翘曲量,增加熔体温度和注射速率会增大复合平板的翘曲量。模具温度的升高会使复合平板的翘曲变形方向朝PMMA侧逐渐增大,模内不对称冷却引起复合平板内部的残余热应力成为翘曲量增大的主要原因,当模具温度为90℃时,复合平板基本无翘曲。所研究的工艺参数中,模具温度和保压时间对复合平板的翘曲影响最为显著。The influence of overmolding injection parameters such as packing pressure,racking time,melt temperature,mold temperature and the injection speed on the warpage of PMMA-PC composite boards was investigated.The result shows that the warpage of PMMA-PC composite boards exhibits the tendency of decreasing first and then increasing with the increase of packing pressure;However,the prolongation of packing time is beneficial to reduce the warpage of composite boards,increasing melt temperature and injection speed will lead to the increase of the warpage composite boards.When mold temperature increases,the composite boards bend towards the PMMA side.Asymmetrical cooling in the mold resulting in internal residual thermal stress in composite boards is the main reason of the increase of the warpage,when the mold temperature is 90℃,no warpage occurs in the composite boards.Among these parameters studied,mold temperature and packing time influence the most significantly on the warpage of the composite boards.

关 键 词：二次注射成型 翘曲 聚甲基丙烯酸甲酯 聚碳酸酯 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]