某机载电子设备中片式厚膜电阻器失效机理分析  

Failure Mechanism Analysis of Chip Thick Film Resistor for an Airborne Electronic Equipment

作　　者：刘玮 高东阳 席善斌[1] 石中玉 张魁[1] 黄杰[1] 彭浩[1] Liu Wei;Gao Dong-yang;Xi Shan-bin;Shi Zhong-yu;Zhang Kui;Huang Jie;Peng Hao(The 13th Research Institute,CETC,Hebei Shijiazhuang 050051)

机构地区：[1]中国电子科技集团有限公司第十三研究所,河北石家庄050051

出　　处：《电子质量》2018年第3期23-25,共3页Electronics Quality

摘　　要：对某机载电子设备中片式厚膜电阻器的失效机理进行了研究,结果表明:电阻器的失效与生产制作工艺流程中的微小偏差、长期使用过程中受到的机械及温度应力以及大气中有害气氛的侵蚀均有密切的关系,给出了预防措施及电阻器的选用建议。The failure mechanism of chip thick film resistor for an airborne electronic equipment was researched.The result shows that the failure of the resistor is closely related to the minor deviation in the manufacturing process,the mechanical and temperature stress during the long-term using and the erosion of harmful gas in the atmosphere.The preventive measures and the selection advices of resistor are given.

关 键 词：片式厚膜电阻器 失效机理 预防措施 

分 类 号：TM54[电气工程—电器]