介观尺度下单颗磨粒对切屑变形区应力影响研究  

The Influencing Study of the Single Abrasive Grain on the Chip Stress under the Mesoscopic Scale

作　　者：郑向周 ZHENG Xiang-zhou(Department of Mechanical and Electronic Engineering,Yuncheng Polytechnic College,Yuncheng Shanxi 044000,China)

机构地区：[1]运城职业技术学院机电工程系,山西运城044000

出　　处：《组合机床与自动化加工技术》2018年第4期57-59,65,共4页Modular Machine Tool & Automatic Manufacturing Technique

摘　　要：为研究TC4合金在介观尺度下的磨削过程中切屑变形区的应力分布对切屑的形成及磨削工件表面质量的影响,基于热-力耦合理论建立了单颗磨粒磨削理论模型,并利用ABAQUS对磨削过程进行了有限元仿真分析。仿真结果表明:当磨削深度小于0.5μm时,继续减小有利于减小切屑变形区流动应力的变化幅度,从而提高工件质量;与磨粒圆锥角度相比,磨削速度对切屑变形区应力变化影响更为显著,其变化值基本保持在400MPa左右。研究结果对进一步提高工件表面质量及TC4合金的磨削性能奠定了理论基础。In order to study the effect of the chip deformation zone stress distribution in the TC4 alloy grinding on the chip formation process in the mesoscopic scale and grinding the workpiece surface quality,single grain grinding model has been established based on the thermal stress coupled,and the finite element simulation analysis of the grinding process has been made in ABAQUS.It showed that when the grinding depth was less than 0.5μm,continuing to reduce the grinding depth could reduce the amplitude of variation of chip deformation flow stress,so as to improve the quality of the workpiece.Compared with the abrasive cone angle,grinding speed on chip deformation zone stress change was more obvious,and its change value remained at around 400MPa.Results has laid a theoretical foundation for improving the surface quality of workpiece and the grinding performance of TC4 alloy.

关 键 词：介观尺度 单颗磨粒磨削 切屑变形区 

分 类 号：TH16[机械工程—机械制造及自动化] TG58[金属学及工艺—金属切削加工及机床]