片状银粉的制备及在电子浆料中的应用研究进展  

Research Progress on Preparation of Flake Sliver Powder and Its Application in Electronic Pastes

作　　者：孟宪伟[1] 胡昌义[1] 冯清福 郭帅龙 杨宏伟[1] 杨宇雯 李郁秀 冯璐[1] MENG Xianwei;HU Changyi;FENG Qingfu;GUO Shuailong;YANG Hongwei;YANG Yuwen;LI Yuxiu;FENG Lu(State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals,Kunming 650106)

机构地区：[1]昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,昆明650106

出　　处：《材料导报》2017年第A01期273-276,共4页Materials Reports

基　　金：国家自然科学基金(21363011);云南省院所开发专项(2016DC033);云南省重点新产品开发项目(2016BA007)

摘　　要：近年来,随着电子和信息的高速发展,对电子浆料的性能要求越来越高。导电填料作为导电浆料的重要组成部分,决定了浆料的性能。本文介绍了有着广泛应用的金属系导电填料——银粉,概述了银粉的尺寸和形貌对导电浆料的影响,阐述了不同制备方法获得的片状银粉对电子浆料性能的影响,并探讨了存在的问题。In recent years,with the rapid development of electronics and information technology,demand on the electronic pastes properties is more and more urgent.Conductive fillers are one of the most important components,which define the properties of electronic pastes.In this paper,the metal series conductive filler-sliver powder was generally introduced,and the effects of size and morphology of sliver powder on electronic pastes were outlined.Meanwhile,the influence of flake sliver powder prepared with different methods on the properties of electronic pastes was introduced,and the existing problems were discussed.

关 键 词：电子浆料 填料 超细 片状银粉 制备方法 

分 类 号：TM241[一般工业技术—材料科学与工程]