废印刷电路板非金属粉负载二氧化硅杂化填料的制备及其在不饱和聚酯中的应用  

Preparation of WPCBP/SiO_2 Hybrid Filler and Its Application in Unsaturated Polyester Resin

作　　者：胡德超 贾志欣 钟邦超 董焕焕 丁勇 罗远芳[1] 贾德民[1] HU Dechao;JIA Zhixin;ZHONG Bangchao;DONG Huanhuan;DING Yong;LUO Yuanfang;JIA Demin(School of Materials Science and Engineering,Guangdong Key Laboratory of High Performance and FunctionalPolymer Materials,South China University of Technology,Guangzhou 510640)

机构地区：[1]华南理工大学材料科学与工程学院,广东省高性能与功能高分子材料重点实验室,广州510640

出　　处：《材料导报》2018年第2期278-281,287,共5页Materials Reports

基　　金：广东省应用型科技研发专项资金(2015B020237004)

摘　　要：为增强废印刷电路板非金属粉(WPCBP)与聚合物基体之间的界面结合作用,采用溶胶-凝胶法在WPCBP表面原位负载了一层纳米二氧化硅粒子(SiO_2),制备了一种新型的WPCBP-SiO_2杂化填料。SEM、TGA和FTIR证明SiO_2通过化学键成功负载到了杂化填料的表面。采用含双键的界面改性剂对杂化填料进行改性后,应用于不饱和聚酯树脂基体,探讨了未改性杂化填料及表面改性杂化填料对不饱和聚酯复合材料的力学性能、界面结合作用和热稳定性能的影响。结果表明,新型的杂化填料WPCBP-SiO_2能够与不饱和聚酯基体形成强的界面结合作用,显著提高不饱和聚酯复合材料的力学性能和热稳定性能,且表面改性后复合材料的各项性能得到进一步提高。To strengthen the interfacial interaction between waste printed circuit boards powders(WPCBP)and polymer matrix,WPCBP was immobilized a layer of SiO 2 nanoparticles to form a novel WPCBP-SiO 2 hybrid filler by sol-gel method.SEM,TGA and FTIR suggested that SiO 2 nanoparticles were chemically bonded onto the surface of WPCBP.Then WPCBP-SiO 2 hybrid filler was modified with a silane coupling agent and incorporated in unsaturated polyester resin(UPE)matrix.The effect of WPCBP-SiO 2 hybrid filler on mechanical properties,interfacial bonding and thermal stability of UPE composites were comprehensively explored.It has been confirmed that WPCBP-SiO 2 hybrid filler could form a strong interfacial interaction with polymer matrix,and markedly enhance the mechanical properties and thermal stability of UPE composites.Besides,the modification of hybrid filler give further improvements of UPE composites.

关 键 词：杂化填料 废印刷电路板非金属粉 不饱和聚酯树脂 力学性能 补强机理 热稳定性 

分 类 号：TQ327[化学工程—合成树脂塑料工业]