高导热金刚石/铜复合材料界面修饰研究进展  

Research Progress on Interfacial Modification of Diamond/Copper Composites with High Thermal Conductivity

作　　者：张晓宇 许旻[1] 曹生珠[1,2] ZHANG Xiaoyu;XU Min;CAO Shengzhu(Lanzhou Institute of Physics,Lanzhou 730000;Science and Technology on Vacuum Technology and Physics Laboratory,Lanzhou 730000)

机构地区：[1]兰州空间技术物理研究所,兰州730000 [2]真空技术与物理国防科技重点实验室,兰州730000

出　　处：《材料导报》2018年第3期443-452,共10页Materials Reports

摘　　要：界面结合良好的金刚石/铜复合材料具有优异的热物理性能。通过各种手段修饰金刚石-铜界面能够充分发挥金刚石/铜复合材料的高导热潜力。综述了制备金刚石/铜复合材料时主要的两类界面修饰方法:金刚石表面预镀碳化物形成元素和对铜基体预合金化,并对这两类修饰手段的制备工艺和导热机制进行了简单评述。探讨了金刚石/铜复合材料制备及界面修饰领域目前存在的问题及发展趋势。Diamond/copper composites with well-bonded interface have excellent thermophysical properties.Modified by various means,the diamond-copper interface can sufficiently enhance the thermal conductivity of diamond/copper composites.In this paper,recent progress about two main kinds of interfacial modification methods to prepare diamond/copper composite was reviewed,respectively as the preplating of carbide forming elements on diamond surface and pre-alloying of copper substrate.Preparation process and thermal conduction mechanism of these two modification methods were introduced briefly.The existing problems and development trend of diamond/copper composite preparation and interface modification were discussed.

关 键 词：金刚石/铜复合材料 界面修饰 热导率 金属基复合材料 

分 类 号：TB333[一般工业技术—材料科学与工程]