PEG/PAM复合定形相变材料的制备与热性能  

Synthesis and thermal performance of PEG/PAM shape-stabilized composite phase change materials

作　　者：付维贵[1,2] 索海涛 林贵德 吴春辉 梁丽 孙宝山[3] FU Wei-gui;SUO Hai-tao;LIN Gui-de;WU Chun-hui;LIANG Li;SUN Bao-shan(School of Material Science and Engineering,Tinanjin Polytechnic University,Tianjin 300387,China;State Key Laboratory of Separation Membranes and Membrane Processes,Tinanjin Polytechnic University,Tianjin 300387,China;School of Computer Science and Software Engineering,Tianjin Polytechnic University,Tianjin 300387,China)

机构地区：[1]天津工业大学材料科学与工程学院,天津300387 [2]天津工业大学省部共建膜分离与膜过程国家重点实验室,天津300387 [3]天津工业大学计算机科学与软件学院,天津300387

出　　处：《天津工业大学学报》2018年第2期55-61,共7页Journal of Tiangong University

基　　金：天津市应用基础与前沿技术研究计划(青年基金)项目(14JCQNJC03200);天津市大学生创新项目(201510058064)

摘　　要：为了设计制备具有较高相变焓的复合定形相变材料,采用化学交联法制备半互穿网络型聚乙二醇/聚丙烯酰胺(PEG/PAM)复合定形相变材料,并通过分子动力学模拟计算其导热系数;采用DSC、TG、泄漏率测试和导热系数测试对复合材料的热性能、热稳定性、固-固定形效果和导热性能进行研究.结果表明:随着PAM含量升高,PEG/PAM复合材料的热焓值和泄漏率降低,热稳定性和导热率增加.其中,PEG质量分数为70%时,复合相变材料具有高的相变焓107 J/g、良好的热稳定性和优异的定形效果.通过模拟计算得出的导热系数值和实验值相一致,误差值都小于5%.本结论能对更复杂复合定形相变材料的导热系数进行预测和理论指导.In order to design and prepare shape-stabilized composite phase change materials(ss-CPCM)with higher phase transition enthalpy,polyethylene glycol/polyacrylamide(PEG/PAM)ss-CPCM with semi-interpenetrating network structure were synthesized via chemical cross-linking method and its thermal conductivity was simulated by molecular dynamics.The thermal property,thermal stability,shape effect and thermal reliability were characterized by DSC,TG,leakage measurement and thermal conductivity measurement.The results indicate that with the increase of PAM content,the enthalpy and leakage rate decrease,and thermal stability and thermal conductivity of PEG/PAM composites increase.Among them,the ss-CPCM with 70%PEG has high enthalpy(107 J/g),good thermal stability and excellent shape effect.The simulation results show that the thermal conductivity agree well with the experimental values,and the error values are all about 5%,which can predict and theoretically guide for thermal conductivity of more complex ss-CPCM.

关 键 词：PEG/PAM 定形相变材料 半互穿网络 分子动力学模拟 导热系数 

分 类 号：TB332[一般工业技术—材料科学与工程] TQ316.64[化学工程—高聚物工业]