底充胶固化模型研究  

Research on Curing Model of Underfill

作　　者：黄志慧 孟庆端 

机构地区：[1]河南科技大学电气工程学院,河南洛阳471023

出　　处：《河南科技大学学报（自然科学版）》2018年第4期6-10,15,共6页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学青年基金项目(61505048);航空科学基金项目(20152442001)

摘　　要：针对底充胶固化模型构建复杂的难题,提出了一种基于费米-狄拉克分布函数的底充胶固化模型。利用费米-狄拉克分布函数来描述底充胶固化过程中杨氏模量E和线膨胀系数αl随温度的变化规律,并借助有限元软件ANSYS,建立了由石英玻璃和底充胶两层材料构成的理论验证模型。模拟得到的边沿处法线方向位移和实测结果高度吻合。To solve the problem that the construction of a curing model of underfill was complicated,a curing model of underfill was proposed based on the Fermi-Dirac distribution function. The Fermi-Dirac distribution function was used to describe the temperature dependence of both the Young's modulus E and the coefficient of linear expansion αlof the underfill in curing process. A theoretical verification model composed of quartz glass and underfill layer was built by using the ANSYS software. The simulated displacement along the normal direction at the edge is in good agreement with the measured data.

关 键 词：黏弹性Maxwell模型 杨氏模量 线膨胀系数 费米-狄拉克分布 

分 类 号：TN253[电子电信—物理电子学]