Direct active soldering of Al_(0.3)CrFe _(1.5)MnNi_(0.5) high entropy alloy to 6061-Al using Sn-Ag-Ti active solder  

利用Sn-Ag-Ti活性焊料直接活化软焊接合Al_(0.3)CrFe _(1.5)MnNi_(0.5)高熵合金与6061铝合金（英文）

作　　者：L.C.TSAO S.Y.CHANG Y.C.YU 

机构地区：[1]Department of Materials Engineering, National Pingtung University of Science & Technology [2]Department of Mechanical Engineering, National Yunlin University of Science & Technology

出　　处：《Transactions of Nonferrous Metals Society of China》2018年第4期748-756,共9页中国有色金属学报（英文版）

基　　金：financial support of this work from the Ministry of Science and Technology, Taibei, China, under Projects No. MOST 105-ET-E-020002-ET, 105-2622-E-020-003-CC3

摘　　要：Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.高熵合金Al_(0.3)Cr Fe_(1.5)Mn Ni_(0.5)(HEA)具有许多特殊性能。在大气环境、接合温度为250℃保持60 s的条件下,以Sn3.5Ag4Ti为活性焊料对HEA/HEA及HEA/6061-Al进行直接活性软焊接合,并对其进行显微组织及剪力强度分析。实验结果显示,在接合过程中,高熵合金中所有元素缓慢扩散进入连接区域。HEA/HEA和HEA/6061-Al样品的剪切强度分别为(14.20±1.63)和(15.70±1.35)MPa。HEA/6061-Al样品的断裂面呈显明显的半脆性断裂特征。

关 键 词：high entropy alloy Sn3.5Ag4Ti active filler Al0.3CrFe1.5MnNi0.5 direct active soldering 

分 类 号：TG457.1[金属学及工艺—焊接]