高温高压法制备金刚石/铜复合材料的研究  

Study on preparation of diamond/copper composites by high temperature and high pressure method

作　　者：赵龙 宋平新[1] 张迎九[1] 杨涛 马姗姗[1] 王彩利[1] ZHAO Long;SONG Pingxin;ZHANG Yingjiu;YANG Tao;MA Shanshan;WANG Caili(Key Material Physics Laboratory of the Ministry of Education,Institute of Physical Science and Engineering of Zhengzhou University,Zhengzhou 450052,China)

机构地区：[1]郑州大学物理工程学院/材料物理教育部重点实验室,郑州450052

出　　处：《金刚石与磨料磨具工程》2018年第2期15-19,共5页Diamond & Abrasives Engineering

基　　金：河南省教育厅项目"高导热金刚石/铜电子封装复合材料的研制及产业化"(X0004650);"金属电子封装复合材料的产业化研究"(20160214A)

摘　　要：采用高温高压法制备金刚石/铜复合材料。研究金刚石体积分数、烧结压力、保温时间、烧结温度、金刚石表面金属化对金刚石/铜复合材料热导率及热膨胀系数的影响。实验表明:金刚石体积分数70%,烧结压力2GPa,烧结时间300s,烧结温度1200℃时,金刚石/铜复合材料热导率达426 W/(m·K)。Diamond-copper composites were prepared by high temperature and high pressure method(HPHT).The effects of diamond volume fraction,sintering pressure,holding time,sintering temperature,surface metallization of diamond on thermal conductivity and thermal expansion coefficient of diamond-copper composites were studied.The experimental results show that when diamond volume fraction is70%,sibtering pressure is 2 GPa,sintering time is 300 s,and sintering temperature is 1200℃,the thermal conductivity of diamond-copper composite material reaches 426 W/(m.K).

关 键 词：高温高压法 金刚石/铜复合材料 热导率 热膨账系数 

分 类 号：TG74[金属学及工艺—刀具与模具] TQ164[化学工程—高温制品工业]