金属基印制板——高导热化印制板(3)  

Metal cased PCB-high thermal conductive PCB(3)

作　　者：林金堵(本刊名誉主编) Lin Jingdu

机构地区：[1]不详

出　　处：《印制电路信息》2018年第8期52-56,共5页Printed Circuit Information

摘　　要：文章概述了金属基印制板的特点、结构和应用领域。在PCB电路和金属基之间必须设置导热绝缘层,而导热绝缘层的导热系数和厚度将决定着金属基导热性能高低。大多数的金属基印制板的导热系数处在(1.0-6.0)W/m.K之间,大多数是以单面铝基印制板的结构而应用于各个领域,特殊应用场合采用殷钢基或铜基印制板。This paper introduces the feature,structure and application of metal based PCB.Since metal is the conductive material,the heat conduction insulation layer should be designed.The head conduction ratio and thickness of the layer will determine the performance of metal base conduction.Most metal base PCB conduction ratio is between 1.0~6.0 W/m.K and is single-sided aluminum based PCB.Some special applications use Invar alloy or copper based PCB.

关 键 词：金属基印制板 铝基覆铜箔板 导热系数 发光二极管 

分 类 号：TN41[电子电信—微电子学与固体电子学]