球磨时间对石墨烯/ODS铜基复合材料组织与性能的影响  

Effects of ball milling time on microstructures and properties of graphene/ODS copper composite materials

作　　者：杨长毅 刘允中[1] 余开斌 YANG Changyi;LIU Yunzhong;YU Kaibin(School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China)

机构地区：[1]华南理工大学机械与汽车工程学院,广州510640

出　　处：《粉末冶金材料科学与工程》2018年第3期281-291,共11页Materials Science and Engineering of Powder Metallurgy

基　　金：国家重点研发计划资助项目(2017YFB0305700);中央高校基本科研业务费专项资金资助项目(x2jq D2170770)

摘　　要：在铜粉中加入0.1%氧化石墨烯与0.5%超细氧化铝颗粒(均为质量分数)进行混合机械球磨,然后真空热压致密化,并同时实现氧化石墨烯的热还原,从而在ODS(oxide dispersion strengthened,氧化物弥散强化)铜基复合材料中引入石墨烯作为第二增强相,制备出石墨烯/ODS铜基复合材料。利用扫描电镜(SEM)、X射线衍射(XRD)、拉曼光谱(Raman spectra)、力学和物理性能测试等,研究球磨时间对复合粉末及其烧结后的组织与性能的影响。结果表明,随球磨时间增加(0~8 h),复合材料的力学性能和物理性能都提高。当球磨时间为8 h时,石墨烯在铜基体中有较好的结合与分布,材料综合性能最佳,石墨烯/ODS铜基复合材料的压缩屈服强度为324 MPa,比ODS铜合金的屈服强度(250 MPa)提高29.6%;抗弯强度为621 MPa,非常接近ODS铜合金(629 MPa),弯曲断口为韧性断裂;维氏硬度(HV)为100;电导率达到87.23%IACS;热导率为385 W/(m·K)。A mixture of 0.1%graphene oxide and 0.5%ultrafine alumina particles(both mass fraction)were added to the copper powder for a mixed mechanical milling.Then the powders mixture was densified by vacuum hot pressing sintering technique and the thermal reduction of graphene oxide was realized at the same time.Graphene/ODS(G/ODS)copper matrix composites were prepared using graphene as the second reinforcement phase in the copper matrix composite.The effects of milling time on the microstructures and properties of Cu-0.5Al2O3-0.1GO composite before and after sintering were studied by SEM,XRD,Raman spectrum,mechanical properties test and physical properties test.The results show that the mechanical and physics properties both increase by increasing ball milling time(0?8 h).Graphene has a better combination and distribution in copper matrix with the 8-hour ball milling,which result in optimal comprehensive properties of sintered composites.The compression yield strength of G/ODS copper composite is 324MPa,29.6%higher than that of ODS copper(250 MPa).The bending strength is 621 MPa,which is very near to that of ODS copper(629 MPa).The fracture mechanism of the composite is ductile fracture.The hardness,electric conductivity and thermal conductivity are 100 HV,87.23%IACS and 385 W/(m·K),respectively.

关 键 词：湿磨法 球磨时间 真空热压 G/ODS铜基复合材料 组织性能 

分 类 号：TB333[一般工业技术—材料科学与工程] TG146.11[金属学及工艺—金属材料]