电子芯片散热技术的研究现状及发展前景  

Research Status and Development Prospect of the Chip Cooling Technologies

作　　者：刘芳 杨志鹏 袁卫星[2] 任柯先 LIU Fang;YANG Zhi-peng;YUAN Wei-xing;REN Ke-xian(School of Environment and Energy Engineering,Beijing University of Civil Engineering and Architecture,Key Lab of Heating,Gas Supply, Ventilating and Air Conditioning Engineering,Beijing 100044,China;School of Aeronautic Science and Engineering,BeiHang University,Beijing 100083,China)

机构地区：[1]北京建筑大学环境与能源工程学院,暖燃重点实验室,北京100044 [2]北京航空航天大学航空科学与工程学院,北京100083

出　　处：《科学技术与工程》2018年第23期163-169,共7页Science Technology and Engineering

基　　金：北京市科委基金(KZ70000401)资助

摘　　要：随着芯片热流密度越来越大,传统的风冷已不能满足散热要求。概述了7种具有应用前景的芯片散热技术,介绍了各种散热技术的工作原理、优缺点、适用场合、研究现状及所存在的关键问题,最后对电子芯片散热技术进行了总结和展望。With the increasing of chip heat flux,the traditional air cooling cannot meet the requirement of heat dissipation.7 kinds of promising chip cooling technologies were introduced,including the working principle,the advantages and disadvantages,application,research status and the key problems of existence.In the end,the summary and prospect were conducted for various technologies.

关 键 词：电子芯片 散热技术 研究现状 

分 类 号：TK172[动力工程及工程热物理—热能工程]