Wetting of molten Sn-3.5Ag-0.5Cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite  

Sn-3.5Ag-0.5Cu在高体积分数SiC_p/Al复合材料Ni-P(-SiC)镀层上的润湿性（英文）

作　　者：Xiang-zhao ZHANG Xiao-lang WU Gui-wu LIU Wen-qiang LUO Ya-jie GUO Hai-cheng SHAO Guan-jun QIAO 张相召;吴晓浪;刘桂武;骆文强;郭亚杰;邵海成;乔冠军(江苏大学材料科学与工程学院,镇江212013;长安大学材料科学与工程学院,西安710064;西安交通大学金属材料强度国家重点实验室,西安710049)

机构地区：[1]School of Materials Science and Engineering,Jiangsu University,Zhenjiang 212013,China [2]School of Materials Science and Engineering,Chang’an University,Xi’an 710064,China [3]State Key Laboratory for Mechanical Behavior of Materials,Xi’an Jiaotong University,Xi’an 710049,China

出　　处：《Transactions of Nonferrous Metals Society of China》2018年第9期1784-1792,共9页中国有色金属学报（英文版）

基　　金：Projects(51572112,51401034)supported by the National Natural Science Foundation of China;Project(BK20151340)supported by the Natural Science Foundation of Jiangsu Province,China;Projects(2014-XCL-002,TD-XCL-004)supported by the Six Talent Peaks Project of Jiangsu Province,China;Project(BRA2017387)supported by the 333 Talents Project of Jiangsu Province,China;Project([2015]26)supported by the Innovation/Entrepreneurship Program of Jiangsu Province,China;Project([2016]15)supported by the Qing Lan Project,China

摘　　要：The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed.The SiC particles are evenly distributed in the coating and enveloped with Ni.No reaction layer is observed at the coating/SiCp/Al composite interfaces.The contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,respectively.An interaction layer containing Cu,Ni,Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer.Moreover,the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.基于化学镀Ni工艺,研究Sn-3.5Ag-0.5Cu合金在Ni-P(-SiC)镀层/SiCp/Al基体上的润湿行为,分析镀层的显微结构和Sn-3.5Ag-0.5Cu/Ni-P(-SiC)镀层/SiCp/Al体系的润湿和界面行为。结果表明,SiC颗粒均匀地分布在镀层中,且Ni-P(-SiC)镀层与SiCp/Al复合材料之间没有界面反应。Sn-3.5Ag-0.5Cu对Ni-P、Ni-P-3SiC、Ni-P-6SiC和Ni-P-9SiC镀层/SiCp/Al基体对应的最终接触角分别为~19°、29°、43°和113°。在Sn-3.5Ag-0.5Cu/Ni-P-(0,3,6)SiC镀层/SiCp/Al界面处形成含有Cu、Ni、Sn和P的反应层,其主要包含Cu-Ni-Sn和Ni-Sn-P相。此外,熔融的Sn-Ag-Cu合金可以通过Ni-P/SiC界面渗入Ni-P(-SiC)复合镀层与SiCp/Al基体接触。

关 键 词：Ni coating Sn-Ag-Cu alloy SiCp/Al composite WETTING microstructures interface 

分 类 号：TB333[一般工业技术—材料科学与工程]